ISO/NGP resin for SMC and BMC applications

Palapreg® P 6028-901 is a special resin for the molding of m-benzene/neopentylene glycol. The molding products have the advantages of good cracking resistance, high heat resistance, good water resistance and so on. It is mainly used in the electronic and electrical market.   Palapreg®P6028-901 Molded resin is used for SMC and BMC production. Used in combination with LS additives such as Palapreg®H814-902 to manufacture SMC/BMC components with low shrinkage, excellent surface smoothness and shine, and deep and even pigmentation. Good heat resistance is achieved even at high polystyrene levels. Palapreg®P6028-901 can be easily thickened with magnesium oxide.   It should be placed in a dark and dry place at a temperature of 5℃~ 30℃. If the storage temperature is higher, the shelf life will be affected and the performance of the resin will be reduced. The shelf life of styrene containing unsaturated polyester is significantly reduced when exposed to light. Ther…