Aluminum Nitride Ceramic AMB Copper-clad Substrate

Aluminum Nitride Ceramic AMB Copper-clad Substrate The thermal conductivity of aluminum nitride is way higher than that of aluminum oxide and silicon nitride. It's got really excellent thermal conductivity and can easily meet the heat dissipation needs in some working environments where there's high power and large current. The AMB aluminum nitride ceramic substrate has stronger bonding strength and is good at resisting thermal and cold shocks. The reliability test data shows that during the thermal and cold shock test (with the temperature ranging from -55 to 150 °C, staying at both high and low temperatures for 15 minutes each, and the transition time less than 30 seconds), the cycle life of Si3N4 can reach over 5,000 times. But for AlN and Al2O3, their cycle lives can reach several hundred times.     The AMB ceramic substrate has been maturely applied in the packaging of power devices/modules in fields such as rail transit, new energy vehicles, and smart grids. Af…